ECAL Settembre 2004 GRI M. Diemoz - INFN Roma

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1 ECAL ettembre 2004

2 Indice Cristalli tato costruzione CR Elettronica Chips, VFE boards, FE boards, integrazione Impegni INFN

3 Cristalli top della produzione in BTCP Febbraio 2004 (24900 l consegnati) Azzeramento dei contratti, ridiscussione del prezzo dei cristalli e accordo per una produzione ad interim di: 6000 l al ritmo di 1000/mese (fine I mezzo barrel 30 kl) 9000 l al ritmo di 1200/mese entro maggio 2005 Produzione piena ripresa a Maggio: ad oggi consegnati 3900 l Totale cristalli consegnati ad oggi: Nuovo tender per 21kl barrel + 15kl endcap Coinvolgimento di altri produttori per rispettare la schedula V34: ultimo EB Xl < Q e EE < Q Tender formale lanciato in luglio con specifiche BTCP e richiesta di una quantità minima pari a 1D+2M Risposte positive (nel senso della quantità) da: BTCP, IC, North Crystal (cristalli di Alice) Complessa fase di negoziato ad alto livello Frenetica attività di qualifica dei cristalli dei nuovi produttori

4 Cristalli Contatti con IC ripresi fine 2003: consegnati 50 l EE in Gennaio Ordinati altri 200 (50EB+150EE) in Aprile consegnati 30 in Maggio cattiva qualità per problemi di contaminazione durante la produzione North Crystal ha inviato al CERN 7 EE l a fine giugno e alcune decine di tipo Alice cresciuti in condizioni varie a Protvino per test

5 Cristalli I cristalli del IC cresciuti con metodo Bridgman e hanno caratteristiche diverse da quelli russi: 30% di LY in più diverso comportamento sotto irraggiamento parametri ottici scorrelati dalla resistenza alle radiazioni Il batch di gennaio è promettente TUTTO DA CAPIRE E IN PARTICOLARE: MONITOR I cristalli North Crystal hanno proprietà molto simili ai BTCP stesso metodo di crescita di BTCP non ancora sufficientemente radiation hard trategia con i nuovi produttori (in caso di firma contratto): Preserie di 300 cristalli EE che soddisfi tutte le condizioni CM prima di procedere alla produzione di massa Il lavoro di qualifica verrà suddiviso tra i laboratori coinvolti attualmente nei test (Brunel, Caltech, CERN, ETHZ, I.C, INFN Rome+Enea)

6 Programma ENEA 0.37 Gy/h 3.9 Gy/h Gy/h 11.8 Gy/h sat LY rec sat LY rec sat LY rec sat LY rec Apatity-624 BCTP 2491 BCTP 2492 IC-2597 IC (5l) IC-2631 IC-2637 IC-2646 IC (5l)

7 1 aturation parameters for Xtls irradiated at 11.5 Gy/h INFN/ENEA EE dose rate 0.8 rad. ind. abs. coeff. (m -1 ) fit 604 fit 605 fit 606 fit 608 fit time (h)

8 aturation curves for Xtls irradiated at Gy/h 2 INFN/ENEA rad. ind. abs. coeff. (m -1 ) fit 612 fit 613 fit fuori specifica rad hard in specifiche ottiche 614 fit 616 fit time (h)

9 rad. ind. abs. coeff. (m-1) Comparison of LTO µ vs irradiation time for IC2646, BCTP2492 & 38 Gy/h IC 2646 BOGO2492 APA 624 INFN/ENEA M. Diemoz time - INFN (h) Roma

10 R. alerno - Milano Annual Review ett. Test beam permits to achieve per mille precision in the following up of the radiation damage Two super-crystals assembled with 2003 (M1) electronics (MGPA), reasonable noise level reached uper-crystals located on a movable table, to have the same geometry as in CM Laser monitoring system with blue laser (440 nm) and red laser (709 nm) is the final version Beam Movable table uper crystal Misure per capire la tracciabilita dei cristalli cinesi con il laser monitor

11 Irradiation should affect only the light transmission Monitor and correct for the loss in response by the injection of the laser light as reference Relation epected between beam response () and laser response (R) = R 0 R 0 α To obtain α using a logarithm ln = α ln(r/r 0 ) + ln( 0 ) Linear fit ln vs. ln(r/r 0 ) : determination of α independent of the normalization point Errors scaled to give χ 2 /ndf = 1 for a first estimate of the error on α

12 January batch 3 rd period 4 th period 0.5 Gy/h Compute a during three irradiations and one recovery mall recovery determining a difficulties in α 1stIrr = 0.81 ± 0.02 α Rec = 3.5 ± 0.8 α 2ndIrr = 0.93 ± 0.32 α 3rdIrr = 1.3 ± 0.2

13 During short period Fiing mean α for each crystal type (BCTP, IC ) Beam reconstructed response cor is computed from eperimental data cor = R R 0 α Crystal BCTP #31 Crystal IC # % 0.27 % Before corrections After corrections Laser monitor provides a good compensation over short period N.B.: IL CRITALLO E LONTANO DALLA ATURAZIONE

14 Crystal #31 BCTP 0.2 % Laser monitor provides a good compensation over long period too Irradiation Recovery Crystal IC # % Accuracy better than 0.2% for Russian crystals and 0.4% for Chinese ones 1 st Irr. Recovery 2 nd Irr.

15 tato costruzione Moduli & -Moduli M 0 M 1 M 2 M 3 M 4 M 5 M 6 M 7 M 8 M 9 M 10 M 11 M 12 M 13 M 14 M 15 M 16 M 17 M 18 M1 CERN M2 Rome M3 Rome M4 CERN Bare M Complet ed M Module Completed in RC Module Completed & shipped to CERN/lab27 Bare* uper-module Completed uper-module In progress Module In progress

16 Elettronica Digital Voltage Distribution Trigger Fiber(s) Front End Electronics Data Fiber Torre di trigger Power in L V R V F E V F E V F E V F E V F E FE Analog Voltage Distribution HV in Mother Board VFE LVR board Fleible Connection to APD s / VPT s Motherboard con kapton Radicale cambio di disegno nel

17 Front-End Electronics

18 Chip production ummary AD Wafers packaged at CERN (22610 chips) Remaining 31 wafers due by October 8 th MGPA All 48 wafers due back from packaging in coming weeks (enough for all EB/EE) FENIX 21 Wafers currently being packaged at AAT Remaining 27 wafers due back by October 15 th Enough for all EB/EE Buffer/ervice Chips 48 Wafers due back from production by October 22 nd Remains the pacing item for large scale VFE production Enough for all EB Yields Yields have been 80%-95% on the engineering runs

19 Very Front End (VFE) Card Responsibility of ETHZ Minor changes from prototypes New buffer Changes in shielding First Pre-eries produced in July by ACOM.A. Produced 430 cards 340 for a M Delivered 417 which passed the power-on test (at the company) 36 cards with some single channel problems VFE contract awarded to ACOM First production run in the fall (of order 600 pcs) Will load around 2K/month to produce for EB

20 FE Card production First Pre-eries produced in Italy 71 pieces delivered from 100 ordered 68 needed for a M ome soldering problems on about 20 boards Minor changes from pre-series Remove 2 layers from PCB Change 2 resistor values, remove 2 caps Reroute some power from LVRB for better balance Will produce a second pre-series for second M Tender for full production is now out Closes mid October tart of full production around end of the year

21 The future Produce readout for 1 more M this year Use parts already in hand Use lessons learned from first pre-series Full production using production AICs at the start of net year Production will go quickly Need to be ready with all testing/qa to handle the rate Off-Detector production in 2005 Need to prepare for installation in CM!

22 ummary Ecellent progress over the last year Complete prototype phase Engineering Runs of chips Full production of chips in progress Pre-series of all On-Detector electronics Tenders in progress/finished for full On-Detector production Prototypes of Off-Detector electronics Integration of all this electronics is beginning

23 N. Pastrone - Torino Annual Review ett. Cooling & Front-end electronics Bare Module Front-end electronics (fully integrated)

24 Trigger tower layout

25 Motherboard: installazione EQUENZA DI INTALLAZIONE: armafle (nuovo) tra i connettori di griglia inserzione cavi HV nelle Motherboard inserzione dei connettori nella griglia connessione di grounding alla grigia fissaggio dei supporti meccanici test elettrico di connessione di tutti i canali ( 25 APD + sensori temperatura)/mb installazione del blocco barre di cooling ultima verifica connessioni elettriche

26 M10: MB installation new grounding connections grid-cooling block and grid-grid on different modules armafle not a problem

27 MB installation (2)

28 MB final tests after each cooling assembly or disassembly operation (a few leaks) MB kapton connections and HV were tested 2 APD connections found bad on M4 and MB replaced final tests after cooling validation in Build 27 final tests after transportation in Build 867 Comments for the future: validation & HV tests require final test set-ups kapton connection test boards will equip 2 MB = 1 HV ch kapton lenghts were adequate: none broken small improvement in the kapton layout will avoid cracks

29 MB preseries & status M10 MB and cooling first installation completed July 9 Issues: 68 boards (G kapton) ready, tested manually and installed validation test set-up fully debugged and verified in Torino installation test set-up 5 ch prototype ready and working easily chedule: 6 spares available and other 24 boards ready soon assembly of other 52 MB ordered ( waiting for ordered components) MB production tender to be approved by INFN (possibly in eptember) installation M11 by end eptember ( kaptons from 3 companies ) test set-ups in the final version need to be working for production a new HV test/burn-in will be implemented for 8-16 MB in parallel

30 Cooling bars Ino tube inside Al (88%)-i(12%) matri Ultrasound test: 10 % of the production tested 1% discarded (same selection as visual inspection)

31 Cooling installation cooling block lowering should be improved to hold weight while MB need to be adjusted in proper position ( a simple solution has been tried) MB supports need to be attached to cooling block to be stiff

32 M1: MB & cooling

33 M10: Mi-Bare completed

34 Goals: Leak tightness Cooling final tests in Build 27 Mechanical resistance up to 7 bars Water circulation in all pipes Production: Every hydraulic part must be tested: Pressure test at 20 bars during 15 minutes Helium leak test: 10-8 mb l/s Test certificate for each individual pieces Pieces to be tested: grids, inlet manifolds, outlet manifolds, cooling bars, general inlet manifold, general outlet manifold, immersed thermal sensors, inner thermal screen, outer thermal screen.

35 Assembly: Cooling final tests (2) helium leak check after each piece mounting: grid inlet and outlet manifold, cooling bars, general manifold Final tests: Global Helium leak check 20 bars pressure test with GN2 (1 h): measurement of pressure before and after the test Global Helium leak check Global pressure increase rate measurement: calculation of the global leak rate Water filling and Conductance measurement: flow and pressure drop Water heating and verification of the heating of each cooling bar

36 Cooling production After the validation process of last year: 1) tenders for the various parts are already assigned (I.N.F.N. Milano) (cooling blocks, supports for the MB, outlet and inlet pipes, LVR & VFE housings) 2) minor modifications performed to improve mechanics-electronics integration : VFE housings have changed all the pieces have taken an alodinization treatment to improve the grounding schemes the long manifolds for the complete M were redesigned to have less mechanical constraint and a better mounting procedure ERTO connectors have been treated, in order to reduce the scratches between the two facing surfaces when mountingdismounting 3) The production will start in October, after that this summer the preproduction for 2 modules (M10 and M11) was successfull

37 After M10.. Cooling: From October 2 M will be produced and delivered at CERN each month (housings, cooling blocks, return pipes, MB supports, armafle) Most of the production at CECOM: the firm could even to proceed at faster pace need storage space Mother Board: econd M ordered and in production: ready to be installed end of eptember after validation tests Barrel production approved I.N.F.N.: tender still need to be approved (eptember-october) Final production forseen by December-January

38 VFE/LVR/FE installation

39 Token Ring and GOH

40 Un uper Modulo finale su fascio La produzione del I uper Modulo e la sua prova su fascio (fine settembre) è un passo cruciale che non può essere mancato L'integrazione può essere ottimizzata su un II uper Modulo a seguire (ottobre) La collaborazione è fortemente impegnata per realizzare questo obiettivo Week # Month February April June August October March May July eptember November VFE Board Design Com Buffer Pcb Fab 4 TT Assemble Functional Tests Fab 12 PCB (final Buf).25 Buf Assemble 12 PCB Test tart Pre-eries Buffer eries Production Functional Tests FE Board Assemble 10 PCBs Functional Tests Assemble 100 PCBs eries Production Functional Tests Integration and Commissioning of M Integrate Ms M1 M2 M3 Commission Ms M1 M2 GOAL

41 Conclusioni I cristalli continuano ad essere il problema principale ok su tutti gli altri fronti elettronica sistema raffreddamento Integrazione Grande attesa per la presa dati su M10 Impegni INFN in linea con tempi e costi