CMS Pixel Upgrade for Phase I

Transcript

1 CMS Pixel Upgrade for Phase I G.M. Bilei Per il consorzio Tracker Bari, Catania, Firenze, Genova, Milano, Padova, Pavia, Pisa, Perugia, Torino Roma July 3rd 2013

2 New Pixel Detector layout Extra layer in barrel and end-cap Efficient seeding + robust tracking in increasing track density L4 reduce gap to TIB, L1 reduce impact of MS on dxy/dz resolution TDR approved last Sep with strong support from LHCC Pisa G.M. Bilei

3 Parameters: present layout vs upgrade Roma G.M. Bilei 3

4 Pixel Upgrade for Phase I : news and short term The Pixel project is progressing pretty much according to the plan ROC PSI46dig / TBM08: Engineering run submitted in Jan. was delivered in Apr. Performance of new ROC according to specs. High rate test beam end of July. - 6 ROC wafers delivered in first half of April ROC additional wafers (delivered end of May) (more than enough for 3-4 wafers for each production center) High rate Test Beam in DESY (end of July) and at FNAL (Nov.) Sensors: Ready to launch production. PRR (Production Readiness Review passed) HDI: High Density Interconnect circuit pre-series launched Digital Test Boards in production at PSI (ready by Sep.) Preparation of few pilot Forward Pixel modules to be installed in CMS in 2014 to be tested as pilot system with collisions. Goal: to produce in each consortium few and final digital module by end of 2013 Goal: Launch pixel module production by late spring Roma G.M. Bilei 4

5 Overall draft schedule Pixel Construction We are on track so far with the schedule. Installation in CMS planned for winter shutdown Roma G.M. Bilei 5

6 INFN Contribution to 50% of BPix layer 3 Draft INFN Plan 2011 Start setting up Production ~ 8 old analog modules Dec Production of few new modules Late spring 2014 Start mass production Late spring 2015 complete module prod 2016 Commissioning and Installation Half Layer 22 faces 8 modules/faces =176 modules Needs 250 modules allowing for 80% yield and 15% spares Roma Primo modulo analog ROC prodotto in ITALIA G.M. Bilei 6

7 INFN plan and objectives for 2013 Completing construction of 8 old modules with analog ROC at IZM - All parts are available. First 4 modules bump bonded and in testing - INFN production centers basically ready for assembly, testing and qualification In parallel starting with KIT the qualification of the Selex BB process and assessing costs. Set up the readout systems for digital ROC in the lab and get experience. Select Bump Bonding vendor by Oct 2013 at latest. Construction of first prototypes with new digital pixel modules end of 2013 Participate to the DESY high rate test beam in beginning of Aug Preparation for mass construction (new readout cards, database, software analysis, quality control procedures etc.) to start in late spring 2014 Milestone INFN Gruppo I Pixel Upgrade: on track 1/12/2013 Realizzazione primi prototipi nuovi moduli Pixel Upgrade con ROC Digitale Roma G.M. Bilei 7

8 Module construction flow chart Sensors test Pisa Pisa Perugia ROC Test after dicing Padova Company Bump bond Bare Module test Glue HDI to bare module SiN-rails glue Bond ROCs to HD Module testing module characterization Burn-in Perugia/Pisa Half Layer Assembly and testing Bari X-ray calibration TBM and HDI testing Glue/bond TBM to HDI Test before glue HDI to sensor Catania

9 Centro di produzione di Pisa Tasks di Pisa: - Pixel Wafer Sensors QA - Bump Bonding & Bare Module QA - ROC Wafers management - Assemblaggio Base strips 1 2 Test del Bare Module Test Board for DAQ (1) Probe card (2) Bare module Jig (3) Assemblaggio Base strips Incollaggio Base strips (4) Incollaggio bare module su base strips (5) Module handle per trasporto (6) Roma A. Messineo 6

10 Pisa: Attività Bump Bonding 2 Linee di possibile produzione Proge(o con IZM (Bump Sn/Ag) Prodo7 I primi 4 Pixel Bare Modules In tes?ng a Pisa Prog(o con Selex (Bump In) INFN + KIT Produzione prevista a se(embre Primo prototupo INFN Bare Module BPIX prodotto da IZM A. Messineo Roma

11 Pisa: Piano immediato futuro Entro 2013 Adeguamento set- up al nuovo ROC Digitale Nuova geometria wafers 8 gia disponibili: in QA al PSI C,>)K"L848>51"G$."B,-"$%&'"M0--)*>1A"*,>"5=5815N1)" O)P3)M>)/"(3-8*4":;<QRS" G$.T;U5"O@%&'R"0+)/"8*+>)5/S".,/01)",3)-5>8,*",*1A"98>V"-)+>-8M>8,*+"3,++8N1)" OW"+3))/"-)5/,0>"6"0*M,/)/RS Pre produzione di ~10 moduli : pre produzione GV)"30-3,+)",B"N081/8*4">V8+"+)*+,-"X,/01)"95+">,"MV)ME">V)"X,/8B8)/"5++)XN1A">,,1+Y"V5*/18*4"5*/" >V)"*)9"M5N1)"M,**)M>8,*">,">V)"HL&S Sblocco fondi 2013 s.j. " Primo prototipo BPIX Phase I Costruito e qualificato al PSI Procedura assegnazione gara di Bump Bonding per la produzione A. Messineo D,,3)-5>8=)"9,-E",B"&%%"FGHI"J"%(& $%&'"()*+,-".,/01)"234-5/)"6"7-8*/)1951/":;<: Roma !"#"! (81=5*"(>-)018"%(&"?81184)*

12 Centro di ROC Testing di Padova Task di Padova: Test di wafers con ROC psi46dig dopo procedura di taglio, assottigliamento e metallizzazione. Setup (in camera pulita a Padova): Alessi probe-station, Testboard per DAQ, Probe-card, Software sviluppato dal PSI. ad oggi: Testati singoli ROCs analogici. 6 ROCs tagliati, senza bumps. 6 ROCs tagliati, assottigliati e con bumps di Sn/Ag depositati dalla IZM. prossimi mesi: - visita al Paul Scherrer Institute (PSI) per collaborare al test dei primi wafers con ROC dig. - upgrade del setup ed inizio test di 4 wafers. Roma M. Dall Osso

13 Catania HDI Production TBM gluing jig Bonding jig on bonder Electric test setup (mockup) Shipping box Center Setup Mechanical jigs, holders, fixtures: built Electronics boards for test: procured Shipping boxes: Plastic mokups:5 available and in use Anodized Aluminum: 20 under construction in more planned for beginning 2014 Vacuum-gas sealer for 1) long-term storing and 2) shipping: bought early 2013 Ø Ø Ø Ø Ø Old-HDI test prod: ongoing 36 HDIs obtained from PSI all either known-faulty or deteriorated because stored for years with no care 1 used as mechanical model for TBM gluing and bonding 3 glued, bonded, tested OK è shipped to Bari for module construction 9 glued, bonded, ready to be tested 8 available for production (will use only if needed, otherwise give to Germany 15 (4 known-faulty and used for initial gluing and bonding practice, 11 found faulty for various reasons at different prod steps) released to Germany, DESY or Bari for mechanical practice. Salvatore Costa - Catania Vacuum-gas sealer Test prod of upgraded HDI: next Planned to start in fall 2013 Samples of new cable ordered Some electronics boards for test ordered to collaborating producing Institutes 13

14 Centro di assemblaggio di Bari Tasks di Bari: - Mechanical assembly bare module e HDI - Wire bonding e test modulo In Corso Setup completato per la pre- produzione Prove di assemblaggio a secco e con la colla su modulo dummy Assemblato il primo modulo. Microsaldatura e fast test del primo modulo ROC analogico in corso Piani Futuri Assemblaggio rimanen? moduli con ROC analogici Definizione procedure di test Avviamento finalizzazione dei tools di produzione Assemblaggio primi moduli digitali entro 2013 Roma L. Fiore

15 Centro di assemblaggio di Bari Setup Assemblaggio Setup Test Roma L. Fiore

16 Centro di qualificazione di Perugia Tasks di Perugia: - Module thermal cycle tests - Module Xray qualification - Module calibration - Contribution test beam Thermal test box Construction of Thermal test box completed Ongoing optimization of thermal cycles parameter in order to reach the target low temperature of -20 C Control software tested Software integrated with El comandante test bench software Roma M. Menichelli 16

17 Centro di qualificazione di Perugia Full Pixel module tested with small Xray tube Tube characterisacs AcceleraAng Voltage: 40 kv Current: 90 µa Fluorescence target: Molybdenum(Mo): kev Silver(Ag): KeV Cadmium(Cd): 23,3 KeV 17 Roma M. Menichelli

18 Perugia: Setting up high rate test 900 W (200 kv max) tube taken from AMS (designed for radiation damage studies) Tube under optimization both for X-ray fluorescence characterization and for radiation damage studies Roma M. Menichelli 18

19 INFN Pixel Upgrade: status of funding Roma

20 Richieste Sblocco SJ Pixel Luglio 2013 Chiediamo lo sblocco SJ per le seguenti voci Cotruzione Apparati: 10 K su Pisa per Bumb Bonding (ad integrare gli altri 10 K assegnati a Pisa Set. 2012) Obiettivo è costruire pre-prototipi moduli digitali entro 2013 quindi si necessita intero budget per far partire ordine. 47 K su Perugia per chips ROC e TBM e circuiti HDI. Set era stata assegnata una prima parte e messo SJ una seconda. Gli engineering run dei chip ROC e TBM sono stati consegnati, I chip sono in test e funzionano secondo specs. Emissione ordine entro Nov. per produzione Sviluppo: 15 K su MiB per acquisto rivelatori a diamanti della società II-VI. Primi test condotti da RD42 incoraggianti. I dispositivi sembrano avere migliore performance di altri vendors e potrebbero rivelarsi utili anche per capir meglio gli effetti di polarizzazione, Roma G.M. Bilei 20

21 Pixel: Funding Requests for 2014 Roma G.M. Bilei 21

22 Pixel MoU in preparation (April RRB table) INFN contribution to construction 803 Ke (963 KCHF). Roma G.M. Bilei 22

23 Human Resources for Pixel Phase I In Totale circa 15 FTE In linea con quanto previsto e discusso al Gruppo I in Apr Composizione e FTE stabile nel periodo Roma G.M. Bilei 23

24 Tracker personnel and activities!"#$!"#%!"#&!"#'!"#( Difficile fare stima distribuzioni di lungo termine. Distribuzione temporale ed impegni dei gruppi Tracker sono ben bilanciati tra le attività di Operazioni e Maintanence, Costruzione di Fase I, R&D per la Fase 2, Fisica. Nota bene: questa tabella non contiene FTE delle Call di Gr5 CHIPIX65 ( 9 FTE CMS) ed ACTIVE ( 5 FTE CMS). La tabella contiene progetti EU (AIDA, INFIERI)!"#$!"#%!"#&!"#'!"#( )*+,-./0/123 4#5' 445& 4&5' 4#5( 4#5&!"!#$!%#"&'()*+,-. /012 / /016 /017!"!#$!%#8-+9,:, ;;17 ;;13 401; 431< 4310!"!#$!%#=&#$+:'#/ /61/ /61/ / ;17!"!#$!%#=&#$+:'#4 / / 4<1; ;512 ;217!"!#$!%#>?@&A Roma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ilei "%"$!"#$7&$!+6'$/ 8;0/ /108 /:0A A209 A "%"$!"#$<=>&? ; 90@ 90@ 90@

25 INFN Gruppo I April 2011 Roma G.M. Bilei 25

26 Phase 2 R&D Roma G.M. Bilei 26

27 Requirements: HL LHC Tracker Upgrade Increased radiation hardness to 3000 fb -1 Detector meant to survive without maintenance. Robustness and redundancy. Increased granularity to resolve mb/bx Reduce material and improve tracking performance Provide Level-1 CMS HL Upgrade Technical Proposal planned end of 2014 Tracker Technical Design Reports in ~ 2016 Aim at delivering upgraded Tracker for LS3 ( ) Roma G.M. Bilei 27

28 News: Tracker Baseline layout defined Option 4 granularity in strip sensors (on average) 3 more layers of pixellated sensors Unambiguous 3d coordinates helps track finding in high pile-up p T modules in all layers All coordinates available at Level-1 (with cut at ~2 GeV) Powerful pattern recognition for HLT and offline Greatly reduced material. In the whole rapidity range. Up to a factor of 4 at 1.0 < η < 1.5. Tracking resolution improved in all aspects Cost under revision and scrutiny. Draft by October 2013 RRB Roma G.M. Bilei 28

29 Overview INFN CMS Pixel and Tracker R&D 3 main areas of R&D activities in Italy : Readout Chip, Sensors, TK Trigger. Synergies and common projects (PRIN, GR5 calls, RD53) with ATLAS in the 3 areas of R&D 1. Pixel Readout Chip 65 nm CMOS technology for future pixel chip (smaller pixel, lower thresh. & power) CMS Bari, Torino, Perugia, Pisa, Padova, Pavia (CERN, FNAL) 2014 funding request for 70 K submitted SJ (Torino) RD53 common project approved by LHCC (collaboration with ATLAS) CHIPIX65 project submitted to GR5 Call (CMS-ATLAS common effort) 2. Pixel Sensors Different technologies and material under consideration Pixel Planar and 3D Silicon sensors (CMS Bari, Firenze, Milano, Pisa, Torino) Pixel Diamond (Milano) Collaboration with many groups in CMS (FNAL, Purdue, KIT, CERN etc.) ATLAS ACTIVE project submitted to Gr5 call (CMS-ATLAS common effort) Need to start in 2014 either financed by GR5 or GR1. Roma G.M. Bilei

30 Overview INFN Pixel and Tracker R&D 3. Track Trigger with AM Develop a L1 triggering system based on AM New generation of faster and denser AM. Pisa, Perugia (Hardware), Padova, Firenze (Simulations) Common ATLAS and CMS R&D since the last PRIN 2010 PRIN submitted in 2012 Funding request for 11 k submitted to GR1 New mezzanine card to be developed and programmed to perform latency measurements on the VME test stand currently under installation in Perugia and Pisa. 4. Simulations - Simulations studies for Phase 1 Pixel upgrade Catania, Firenze - Simulations studies on different layouts for Phase 2 Tracker and Pixel upgrade Catania, Firenze - Track Trigger simulations Padova, Pisa, Firenze Roma G.M. Bilei 30